congatec Product Categories

congatec COM Express Basic module with AMD G-Series Dual Core Processor T40N 1.0GHz, 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB.

congatec Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

CPU BOARD NXP MX8 2XARM

congatec Standard passive cooling solution for XTX modules conga-X915/X945, surface black, 10mm vertical fins, threaded standoffs

congatec COM Express Type 6 Basic module based on Intel Xeon E-2254ML 4-core processor with 2.5GHz up to 4.2GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh).

congatec Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread.

congatec Standard heatspreader for high performance COM Express module conga-BS57/BE57 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

HEATSINK FOR ATOM 12MM FINS

Modules Accessories IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height.

Single Board Computers Thin Mini-ITX board based on Intel Atom E3930 dual core processor with 1.3/1.8 GHz, 1866 MT/s dual channel DDR3L SODIMM memory interface

Computer-On-Modules - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6102E quad core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

congatec New generation flat panel prototype adapter to develop your own flat panel adapter, including cables set.

congatec COM Express Basic module with Intel Core 2 Duo 1.86GHz Penryn CPU SL9400, 6MB L2 cache and 1066MHz FSB.

HEATSINK FOR SMARC 2.0 NXP

congatec Evaluation platform for Qseven 2.0 ARM based modules. Based on standard conga-QEVAL with special jumper settings for ARM.

congatec COM Express Basic module with Intel Core I7-620LE Processor with 2.0 GHz (BGA) (Max. Turbo Frequency 2.8GHz), 4MB L2 cache, 1066MT/s dual channel DDR3 SODIMM memory interface for up to 8GB. Supports ECC memory only.

Heat Sinks Passive cooling solution with 6mm fin height for Qseven module conga-QAF. All standoffs are with 2.7mm bore hole.

Single Board Computers PSU, 90W; 19V / 4.74A, Plug 7.4x5.1 / 12.5mm length (PSU for all congatec Thin-Mini ITX)

Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA30 with cooling fins. All stand-offs are with M2.5 thread.

congatec Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

Modules Accessories

Computer-On-Modules - COM Qseven module with Intel Atom E3825 dual core processor with 1.33GHz, 1MB L2 cache, 2GB 1066MT/s DDR3L onboard memory and 4GB eMMC onboard flash.

Solid State Drives - SSD Innodisk DEMSR-32GD09SC2DC full-size 32 GB mSATA 3ME3 module (MLC, Standard Grade, 0 C to +70 C)

Solid State Drives - SSD Innodisk DEMSR-16GD09SC2DC full-size 16 GB mSATA 3ME3 module (MLC, Standard Grade, 0 C to +70 C)

Sockets & Adapters Adapter-card for Serial-Com on MFG_NC header of QEV2, Revision A.0