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congatec Newest Products(93)

CONGA-TS67/I7-2655LE

Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Core i7-2655LE Dual Core Processor with 2.0GHz, 4MB L2 cache and 1333MT/s dual channel DDR3 memory interface.

CONGA-TS67/I7-2655LE

Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Core i7-2655LE Dual Core Processor with 2.0GHz, 4MB L2 cache and 1333MT/s dual channel DDR3 memory interface.

conga-TS170/E3-1515MV5

Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Xeon E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB Intel Smart Cache, Intel Iris Pro Graphics P580 and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC me

CONGA-TS67/827E

Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Celeron 827E Processor with 1.4GHz, 1.5MB L2 cache and 1333MT/s dual channel DDR3 memory interface.

CONGA-TS67/B810E

Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Celeron 810E dual core processor with 1.6GHz, 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface.

cab-Pico-ITX-LVDS (conga-PA5)

Computer Cables RS232 adapter cable for conga-QMX6 module console debug application.

conga-SA5/i-HSP-B

Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-SA5/i-CSP-B

Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-SA5/HSP-T

Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.

conga-SA5/i-E3950-4G eMMC16

Computer-On-Modules - COM SMARC 2.0 module with Intel Atom E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

conga-SA5/i-E3940-4G eMMC16

Computer-On-Modules - COM SMARC 2.0 module with Intel Atom E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache, 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

conga-TC175/3965U

Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Celeron 3965U dual core processor with 2.2GHz, 2MB Intel Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

CONGA-TS170/CSP-HP-B

Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.

CONGA-TS170/CSP-HP-B

Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.

CONGA-PA5/I-HSP-T

Heat Sinks Heatspreader solution for conga-PA5 based on lidded Atom E3900 processors. All standoffs are with 2.7 mm threaded hole.

CONGA-PA5/I-HSP-T

Heat Sinks Heatspreader solution for conga-PA5 based on lidded Atom E3900 processors. All standoffs are with 2.7 mm threaded hole.

CONGA-TCA5/I-E3950

Computer-On-Modules - COM COM Express Compact module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.

CONGA-TCA5/I-E3950

Computer-On-Modules - COM COM Express Compact module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.

CONGA-TS170/HSP-HP-T

Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.

CONGA-TS170/HSP-HP-T

Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.

conga-MA3/CSP-B

Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4 with fins. All standoffs are 2.7mm bore hole

conga-CGW01 Wallmount Bracket

Mounting Hardware conga-CGW01 Wallmount Bracket

conga-TCA5/i-E3950 PCIe

Computer-On-Modules - COM COM Express Compact module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Up to 5 PCI Express x1 lanes through PCI Express switch. Industrial g

conga-QA5/E3930-2G eMMC8

Computer-On-Modules - COM Qseven module with Intel Atom E3930 dual core processor with 1.3GHz core frequency up to 1.8GHz, 2MB L2 cache, 2GB 1600MT/s DDR3L onboard memory and 8GB eMMC onboard flash.

068757

congatec

068757

congatec

conga-IA4/IO Shield - Standard

Modules Accessories SATA III cable with 30cm length, shielded, end connectors down/straight

CONGA-TS67/I7-2655LE

Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Core i7-2655LE Dual Core Processor with 2.0GHz, 4MB L2 cache and 1333MT/s dual channel DDR3 memory interface.

conga-TC175/i7-7600U

Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

conga-TS170/G3900E

Computer-On-Modules - COM COM Express Type 6 Basic module with Skylake-H Intel Celeron G3900E dual core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. HM170 chipset.

cab-Pico-ITX-Backlight (conga-PA5)

Computer Cables MXM Connector for Qseven Carrier Boards. 10pcs package. ACES standard type, SMT, lead free, 230 positions, 0.50mm pitch, 7.8mm height.

conga-IC175/3965U

Single Board Computers Thin Mini-ITX board based on Intel Celeron 3965U dual core processor with 2.2GHz, 2MB Intel Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

conga-B7XD/HSP-VP-B

Heat Sinks Standard heatspreader for high performance COM Express Type 7 module conga-TSXD with integrated vapor chamber. All standoffs are M2.5mm thread.

conga-QA5/HSP-T

Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.

conga-IA5/CSP

CPU & Chip Coolers Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins.

conga-MA5/i-CSP-B

Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-MA5/CSP-B

Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

conga-QA3/CSP-B

Heat Sinks Standard heatspreader for Qseven module conga-QA3. All standoffs are with 2.7mm bore hole.

conga-MA30/CSP-T

Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA30 with cooling fins. All stand-offs are with M2.5 thread.

conga-B7XD/HSP-VP-T

Heat Sinks Standard heatspreader for high performance COM Express Type 7 module conga-TSXD with integrated vapor chamber. All standoffs are with 2.7mm bore hole.

conga-TS170/CSA-HP-T

Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

conga-SMX8/i-HSP-B

Heat Sinks Backlight power cable for Pico-ITX to connect LCD panel AUO G170EG01 V.1 (panel part number #10000132 17'' LVDS Panel G170EG01 V.1) for conga-PA5.

conga-SMX8/i-CSP-B

CPU & Chip Coolers Pico-ITX chassis with passive cooling for conga-PA5 with non-lidded Intel Celeron and Pentium processors with IO shield, LED's, power button, 2x USB 2.0, 2.5" HDD mount, 2x antenna holes, 1x UART hole, VESA mounting. Vendor: AKASA

conga-MA30/CSP-B

Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4 with fins. All standoffs are 2.7mm bore hole

conga-PA3/CSP-B

Heat Sinks Passive cooling solution for conga-PA3. Includes conga-PA3/HSP heatspreader and heat sink with 12mm fins. All standoffs are with 2.7 mm bore hole.

conga-TR4/CSA-HP-T

CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

conga-TR4/CSA-HP-B

CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

conga-MA5/i-HSP-T

Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.

conga-MA5/i-HSP-B

Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-TCA5/i-HSP-T

Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.

conga-TS170/CSA-HP-B

Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

conga-QG/HSP-B

Heat Sinks Standard heatspreader for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.

conga-MA5/HSP-B

Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

conga-TCA5/i-HSP-B

Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-TCA5/i-CSP-B

Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-TC170/HSP-T

Heat Sinks Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded.

conga-B7AC/HSP-Cu-B

Heat Sinks Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for modules with TDP up to 17W * Cu = Copper plate * B = Bore hole standoffs

conga-B7AC/HSP-VC-T

Heat Sinks Standard heatspreader for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber. Intended for modules with TDP higher than 17W *VC = Vapor Chamber *T = M2.5 threaded stand-offs

conga-QMX8/HSP-B

Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.

conga-QA5/i-CSP-B

Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-TCA5/HSP-B

Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

conga-TCA5/CSP-B

Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

conga-TC170/HSP-B

Heat Sinks Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.

conga-TS170/CSP-HP-T

Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.

CONGA-TS67/CSP-HP-T

Heat Sinks Standard passive cooling solution for conga-TS67 COM Express Type 6 modules with silver surface, 20mm height, 15mm fins, heatpipe, threaded standoffs.

conga-TR4/HSP-HP-T

Heat Sinks Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are M2.5mm thread.

conga-B7AC/HSP-VC-B

Heat Sinks Standard heatspreader for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber. Intended for modules with TDP higher than 17W *VC = Vapor Chamber *B = 2.7mm bore hole standoffs

conga-B7AC/CSA-Cu-B

CPU & Chip Coolers Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * B = 2.7mm Bor

conga-B7AC/CSP-VC-B

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC = Vapor Chamber * B = 2.7

conga-B7AC/CSP-VC-T

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC= Vapor Chamber * T =M2.5

conga-B7AC/CSA-VC-B

CPU & Chip Coolers Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP higher than 17W * VC = Vapo

conga-B7AC/CSA-VC-T

CPU & Chip Coolers Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP higher than 17W * VC = vapor

conga-QMX8/HSP-T

Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are with 2.7mm bore hole.

conga-QA5/i-HSP-B

Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

conga-IA5/i-CSP

CPU & Chip Coolers Passive cooling solution for conga-IA5 based on lidded Atom E3900 processors with 12mm heatsink fins.

conga-MA5/HSP-T

Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.

conga-QMX8/CSP-B

CPU & Chip Coolers Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.

conga-QA5/CSP-B

Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

conga-QG/CSP-B

Heat Sinks Standard passive cooling for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.

conga-QG/CSP-T

Heat Sinks Standard passive cooling for Qseven module conga-QG. All standoffs are M2.5mm threaded.

conga-TCA5/HSP-T

Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.

conga-TS170/HSP-HP-B

Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

conga-B7AC/HSP-Cu-T

Heat Sinks Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for versions up to 17W TDP * Cu = Copper plate * T = M2.5 threaded standoffs

conga-TC87/CSA-T

CPU & Chip Coolers Standard active cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded, 13mm fins, 23mm overall heat sink height and integrated 12V fan.

conga-TC87/CSA-B

CPU & Chip Coolers Standard active cooling solution for COM Express modules conga-TC87. All standoffs are with 2.7mm bore hole, 13mm fins, 23mm overall heat sink height and integrated 12V fan.

conga-B7AC/CSP-Cu-B

CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs

conga-B7AC/CSP-Cu-T

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * T = M2.5 Thread

conga-TC170/CSA-B-2.7

CPU & Chip Coolers Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.

conga-TR4/CSP-HP-T

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.

conga-TR4/HSP-HP-B

Heat Sinks Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

conga-TR4/CSP-HP-B

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.

conga-B7AC/CSA-Cu-T

CPU & Chip Coolers Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * T = M2.5 thre

conga-MA5/E3950-8G eMMC32

Computer-On-Modules - COM COM Express Mini Type10 module with Intel Atom E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 32GB eMMC onboard flash.

conga-QA5/i-E3950-8G eMMC32

Computer-On-Modules - COM Qseven module with Intel Atom E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 32GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

conga-PA5/i-E3950-8G

Single Board Computers Pico-ITX board based on Intel Atom E3950 quad core processor with 1.6/2.0 GHz and 8GB 1866 MT/s onboard memory. Extended temperature version -40 C to 85 C.

conga-B7XD/i-X-D1539

Computer-On-Modules - COM COM Express Type 7 Basic module with Intel Xeon D1539 processor with 8 Cores, 1.6GHz up to 2.2GHz core frequency, 12MB Cache with Intel Cache Allocation Technology and 2133 MT/s dual channel DDR4 memory interface for up to 48GB SODIMM memory. Feat

X7EVAL/ind

Development Boards & Kits - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Commercial temperature range from -40 C to 85 C.

conga-PA5/Chassis PIX-APH1 lidded

Modules Accessories Qseven module with ultra low-power NXP i.MX8-X DualXPlus processor with 2x ARM Cortex -A35 and 2x ARM Cortex -M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.

conga-PA5/Chassis PIX-APH1 non-lidded

Modules Accessories Qseven module with ultra low-power NXP i.MX8-X DualPlus processor with 2x ARM Cortex -A35 and 2x ARM Cortex -M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.

conga-PA5/Chassis PIX-PPH1 non-lidded

Modules Accessories Qseven module with ultra low-power NXP i.MX8-X QuadXPlus processor with 4x ARM Cortex -A35 and 2x ARM Cortex -M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.