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congatec Newest Products(71)
conga-TS170/E3-1515MV5
Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Xeon E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB Intel Smart Cache, Intel Iris Pro Graphics P580 and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC me
CONGA-TS67/827E
Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Celeron 827E Processor with 1.4GHz, 1.5MB L2 cache and 1333MT/s dual channel DDR3 memory interface.
CONGA-TS67/B810E
Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Celeron 810E dual core processor with 1.6GHz, 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface.
cab-Pico-ITX-LVDS (conga-PA5)
Computer Cables RS232 adapter cable for conga-QMX6 module console debug application.
conga-SA5/i-HSP-B
Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
conga-SA5/HSP-T
Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
conga-SA5/i-E3950-4G eMMC16
Computer-On-Modules - COM SMARC 2.0 module with Intel Atom E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.
CONGA-TS170/CSP-HP-B
Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.
CONGA-PA5/I-HSP-T
Heat Sinks Heatspreader solution for conga-PA5 based on lidded Atom E3900 processors. All standoffs are with 2.7 mm threaded hole.
CONGA-TS170/HSP-HP-T
Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.
conga-MA3/CSP-B
Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4 with fins. All standoffs are 2.7mm bore hole
068757
congatec
conga-IA4/IO Shield - Standard
Modules Accessories SATA III cable with 30cm length, shielded, end connectors down/straight
cab-Pico-ITX-Backlight (conga-PA5)
Computer Cables MXM Connector for Qseven Carrier Boards. 10pcs package. ACES standard type, SMT, lead free, 230 positions, 0.50mm pitch, 7.8mm height.
conga-B7XD/HSP-VP-B
Heat Sinks Standard heatspreader for high performance COM Express Type 7 module conga-TSXD with integrated vapor chamber. All standoffs are M2.5mm thread.
conga-QA5/HSP-T
Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
conga-IA5/CSP
CPU & Chip Coolers Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins.
conga-MA5/i-CSP-B
Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
conga-MA5/CSP-B
Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
conga-QA3/CSP-B
Heat Sinks Standard heatspreader for Qseven module conga-QA3. All standoffs are with 2.7mm bore hole.
conga-MA30/CSP-T
Heat Sinks Standard passive cooling solution for COM Express Type 10 module conga-MA30 with cooling fins. All stand-offs are with M2.5 thread.
conga-B7XD/HSP-VP-T
Heat Sinks Standard heatspreader for high performance COM Express Type 7 module conga-TSXD with integrated vapor chamber. All standoffs are with 2.7mm bore hole.
conga-TS170/CSA-HP-T
Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
conga-SMX8/i-HSP-B
Heat Sinks Backlight power cable for Pico-ITX to connect LCD panel AUO G170EG01 V.1 (panel part number #10000132 17'' LVDS Panel G170EG01 V.1) for conga-PA5.
conga-PA3/CSP-B
Heat Sinks Passive cooling solution for conga-PA3. Includes conga-PA3/HSP heatspreader and heat sink with 12mm fins. All standoffs are with 2.7 mm bore hole.
conga-TR4/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
conga-TR4/CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
conga-MA5/i-HSP-T
Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
conga-TS170/CSA-HP-B
Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
conga-QG/HSP-B
Heat Sinks Standard heatspreader for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.
conga-TCA5/i-CSP-B
Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
conga-B7AC/HSP-Cu-B
Heat Sinks Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for modules with TDP up to 17W * Cu = Copper plate * B = Bore hole standoffs
conga-QMX8/HSP-B
Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.
conga-QA5/i-CSP-B
Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
conga-TCA5/HSP-B
Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
conga-TCA5/CSP-B
Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
conga-TC170/HSP-B
Heat Sinks Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
conga-TS170/CSP-HP-T
Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.
CONGA-TS67/CSP-HP-T
Heat Sinks Standard passive cooling solution for conga-TS67 COM Express Type 6 modules with silver surface, 20mm height, 15mm fins, heatpipe, threaded standoffs.
conga-TR4/HSP-HP-T
Heat Sinks Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are M2.5mm thread.