Discover a vast selection of CPU & Chip Coolers electronic components on Semikart India. Top electronic components from industry leading distributors such as Analog Devices, Texas Instruments, STMicroelectronics, Advanced Semiconductor, Inc., QUALCOMM Incorporated, and others.
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conga-TC570/CSP-HP-T
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.
Category
CPU & Chip Coolers
Mfr Part #
Mfr
congatec
Life Cycle
conga-TC570/CSP-HP-B
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
RG1100B-EAC-EF5174-28
CPU & Chip Coolers Extruded Aluminum Radial fins w/ Copper BaseFan 50x10 Axial w/ PWM
Rego Electronics
New at Mouser
RG3229-AD60E-002
CPU & Chip Coolers Extruded Aluminum Radial fins w/ Cooper baseFan 80x25 Axial w/ PWM
RG3129M-25-002
CPU & Chip Coolers Extruded Aluminum Radial fins w/ Cooper baseFan 80x10 Axial w/ PWM
RG3129-AD35B-002
CPU & Chip Coolers Extruded Aluminum Radial fins w/ Cooper baseFan 80x20 Axial w/ PWM
RG3229-AD50-002
RG3114M(Z)-002
CPU & Chip Coolers Copper Stacked finsFan 70x10 Axial w/ PWM
conga-TC700/CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
New Product
conga-TC700/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.
HPC/sILH-CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs 2.7mm.
conga-HPC/mRLP-CSA-B
CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
conga-HPC/mRLP-CSA-T
CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
HPC/cALP-CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
TC670/CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
HPC/sILH-CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
TC670/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.
conga-TCR8/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.
HPC/cALS-CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans.. All standoffs are M2.5mm threaded.
conga-TCR8/CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.
TCV2/CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
HPC/cALS-CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are with 2.7mm bore hole.
TCV2/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
TCV2/CSP-HP-B
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
B7XI/CSA-HP
CPU & Chip Coolers Standard active cooling solution for COM Express Basic modules conga-B7XI with integrated heat pipes, 39.5mm overall cooling height and integrated 12V fan.
